Today we have an announcement out of left field. Intel has formally revealed it has been working on a new series of processors that combine its high-performance x86 cores with AMD Radeon Graphics into the same processor package using Intel’s own EMIB multi-die technology. If that wasn’t enough, Intel also announced that it is bundling the design with the latest high-bandwidth memory, HBM2.
Intel announced its EMIB technology over the last twelve months, with the core theme being the ability to put multiple and different silicon dies onto the same package at a much higher bandwidth than a standard multi-chip package but at a much lower cost than using a silicon interposer. At Intel’s Manufacturing Day earlier this year, they even produced a slide (above) showcasing what might be possible: a processor package with the x86 cores made on one technology, the graphics made in another, perhaps different IO and memory or wireless technologies too. With EMIB, processor design can become a large game of Lego.
EMIB came to market with the latest Intel Altera FPGAs. By embedding the EMIB required silicon design into the main FPGA and each of the chipsets, the goal was to add multiple memory blocks as well as data transfer blocks in a mix and match scenario, allowing large customers to have the design tailored to what they require. The benefits of EMIB were clear, without the drawbacks of standard MCP design or the cost of interposers: it would also allow a design to go beyond the monolithic reticle limit of standard lithography processes. It was always expected that EMIB would have to find its way into the general processor market, as we start to see high-end server offerings approaching 900 mm2 over multiple silicon dies in a single package.
Since the EMIB announcements, Intel’s Manufacturing Day, and Hot Chips, word has been circulating about how Intel is going to approach this from a consumer stand point. As part of the requirements of Intel’s own integrated graphics solutions, a 2011 cross-licensing deal with NVIDIA was in place – this deal was set to expire from April 1st 2017, and no mention of extending that deal was ever made public. A couple of rumors floated around that Intel were set to make a deal with AMD instead, as despite their x86 rivalry they were a preferred partner in these matters. Numerous outlets with connections in both AMD and Intel had difficulty prizing any information out. Historically Intel refuses to comment on such matters in advance. Other potential leaks include published benchmarks over at SiSoft, although nothing has been made concrete until today.
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